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ap2101/ap2111 document number: ds32015 rev. 3 - 2 1 of 14 www.diodes.com january 2013 ? diodes incorporated ap2101/ap2111 2a single channel curr ent-limited power switch description the ap2101 and ap2111 are integrated high-side power switches optimized for universal serial bus (usb) and other hot-swap applications. the family of devices complies with usb 2.0 and available with both polarities of enable input. they offer current and thermal limiting and short circuit prot ection as well as controlled rise time, under-voltage lockout and auto-discharge functionalities. a 7ms deglitch capability on the open-drain flag output prevents false over-current reporting and does not require any external components. all devices are available in so-8 and msop-8ep packages. features ? single usb port power switches with auto-discharge ? short-circuit current and thermal protection ? 2.45a accurate current limiting ? fast transient response time: 5 s ? 90m ? on-resistance ? reverse current blocking ? input voltage range: 2.7v ? 5.5v ? 0.6ms typical rise time ? very low shutdown current: 1 a (max) ? fault report (flg) with blanking time (7ms typ) ? esd protection: 4kv hbm, 300v mm ? active low (ap2101) or active high (ap2111) enable ? ambient temperature range: -35c to 85c ? so-8 and msop-8ep (exposed pad): available in ?green? molding compound (no br, sb) ? totally lead-free & fully rohs compliant (notes 1 & 2) ? halogen and antimony free. ?green? device (note 3) ? ul recognized, file number e322375 ? iec60950-1 cb scheme certified pin assignments so-8 ( top view ) 1 2 3 4 8 7 6 5 nc out flg ou t gnd en in in msop-8ep 1 2 3 4 8 7 6 5 nc out flg out gnd en in in ( top view ) applications ? consumer electronics ? lcd tv & monitor, game machines ? communications ? set-top-box, gps, smartphone ? computing ? laptop, desktop, servers, printers, docking station, hub notes: 1. eu directive 2002/95/ec (rohs) & 2011/65/eu (roh s 2) compliant. all applicable rohs exemptions applied. 2. see http://www.diodes.com for more in formation about diodes incorpor ated?s definitions of halogen- and antimony-free, "gree n" and lead-free. 3. halogen- and antimony-free "green? products are defined as those which contain <900ppm br omine, <900ppm chlorine (<1500ppm t otal br + cl) and <1000ppm antimony compounds. typical applications circuit 0.1uf in gnd en out on 120uf power supply 2.7v to 5.5v 0.1uf off flg load 10k 10uf ap2111 enable active high
ap2101/ap2111 document number: ds32015 rev. 3 - 2 2 of 14 www.diodes.com january 2013 ? diodes incorporated ap2101/ap2111 available options part number channel enable pin (en) current limit (typical) recommended maximum continuous load current ap2101 1 active low 2.45a 2.0a ap2111 1 active high 2.45a 2.0a pin descriptions pin name pin number functions so-8 msop-8ep gnd 1 1 ground in 2, 3 2, 3 voltage input pin (all in pi ns must be tied together externally) en 4 4 enable input, active low ( ap2101) or active high (ap2111) flg 5 5 over-current and over-temperature fault r eport; open-drain flag is active low when triggered out 6, 7 6, 7 voltage output pin (all out pins must be tied together externally) nc 8 8 no internal connection; recommend tie to out pins exposed tab ? exposed tab exposed pad. it should be connected to gnd and thermal mass for enhanced thermal impedance. it should not be used as electrical ground conduction path. functional block diagram thermal sense flg out gnd in en uvlo current limit current sense deglitch discharge control driver absolute maximum ratings (@t a = +25c, unless otherwise specified.) symbol parameter ratings units esd hbm human body model esd protection 4 kv esd mm machine model esd protection 300 v v in input voltage 6.5 v v out output voltage v in +0.3 v v en , v flg enable voltage 6.5 v i load maximum continuous load current internal limited a t j(max) maximum junction temperature 150 c t st storage temperature range (note 4) -65 to +150 c caution: stresses greater than the 'absol ute maximum ratings' specified above, may cause permanent damage to the device. these are stress ratings only; functional operation of the device at thes e or any other conditions exceeding those indi cated in this specification is not imp lied. device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time. semiconductor devices are esd sensitive and may be damaged by ex posure to esd events. suitable esd precautions should be taken when handling and transporting these devices note: 4. ul recognized rating from -30c to 70c (diodes qualified t st from -65c to 150c)
ap2101/ap2111 document number: ds32015 rev. 3 - 2 3 of 14 www.diodes.com january 2013 ? diodes incorporated ap2101/ap2111 recommended operating conditions (@t a = +25c, unless otherwise specified.) symbol parameter min max units v in input voltage 2.7 5.5 v i out output current 0 2.0 a t a operating ambient temperature -35 85 c v il en input logic low voltage 0 0.8 v v ih en input logic high voltage 2 v in v electrical characteristics (@t a = +25c, v in = +5.0v, unless otherwise specified.) symbol parameter test conditions (note 5) min typ max unit v uvlo input uvlo r load = 1k ? 1.6 1.9 2.5 v i shdn input shutdown current disabled, i out = 0 0.5 1 a i q input quiescent current enabled, i out = 0 45 70 a i leak input leakage current disabled, out grounded 1 a i rev reverse leakage current disabled, v in = 0v, v out = 5v, i rev at v in 0.05 a r ds(on) switch on-resistance v in = 5v, i out = 1.5a t a = +25c msop8-ep 90 115 m ? so-8 95 115 -40c t a +85c 140 v in = 3.3v, i out = 1.5a t a = 25c 115 140 -40c t a +85c 170 i limit over-load current limit v in = 5v, v out = 4.5v, c l =120f 2.1 2.45 2.8 a i trig current limiting trigger threshold output current slew rate (<100a/s) , c l = 100f 2.5 a i short short-circuit current limit enabled into short circuit, c l = 100f 2.5 a t short short-circuit response time v out = 0v to i out = i limit (short applied to output) 5 s v il en input logic low voltage v in = 2.7v to 5.5v 0.8 v v ih en input logic high voltage v in = 2.7v to 5.5v 2 v i sink en input leakage v en = 5v 1 a t d(on) output turn-on delay time c l = 1f, r load = 10 ? 50 s t r output turn-on rise time c l = 1f, r load = 10 ? 0.6 1.5 ms t d(off) output turn-off delay time c l = 1f, r load = 10 ? 4 s t f output turn-off fall time c l = 1f, r load = 10 ? 0.03 0.1 ms r flg flg output fet on-resistance i flg =10ma, c l =100f 20 40 ? t blank flg blanking time c in = 10f, c l = 100f 4 7 15 ms r dis discharge resistance (note 6) v in = 5v, disabled, i out = 1ma 290 ? t shdn thermal shutdown threshold enabled, r load = 1k ? 140 c t hys thermal shutdown hysteresis 25 c ja thermal resistance junction-to- ambient so-8 (note 7) 110 c/w msop-8ep (note 8) 60 c/w notes: 5. pulse-testing techniques maintain junction temperature close to ambient temper ature; thermal effects must be taken in to account separately. 6. the discharge function is active when the device is disa bled (when enable is de-asserted). the discharge function offers a resistive discharge path for the external storage capacitor. this is suitable only to discharge filter capacitors for lim ited time and cannot dissipate steady state currents greater than 8ma. 7. test condition for so-8: device mounted on fr-4, 2oz copper, with minimum recommended pad layout. 8. test condition for msop-8ep: device mounted on 2? x 2? fr -4 substrate pc board, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground plane.
ap2101/ap2111 document number: ds32015 rev. 3 - 2 4 of 14 www.diodes.com january 2013 ? diodes incorporated ap2101/ap2111 typical performance characteristics v en 90% v out t d(on) 10% t d(off) 50% 50% t r 10% 90% t f v en 90% v out t d(on) 10% t d(off) 50% 50% t r 10% 90% t f figure 1. voltage waveforms: ap2101 (left), ap2111 (right) all enable plots are for ap2111 active high turn-on delay and rise time 400s/div turn-off delay and fall time 400s/div turn-on delay and rise time 400s/div turn-off delay and fall time 400s/div vout 2v/div ven 5v/div c l = 1f t a = +25c r l = 5 ? vout 2v/div ven 5v/div c l = 1f t a = 25c r l = 5 ? vout 2v/div ven 5v/div c l = 100f t a = +25c r l = 5 ? vout 2v/div ven 5v/div c l = 100f t a = +25c r l = 5 ?
ap2101/ap2111 document number: ds32015 rev. 3 - 2 5 of 14 www.diodes.com january 2013 ? diodes incorporated ap2101/ap2111 typical performance characteristics (cont.) short circuit current, device enabled into short 500us/div inrush current 1ms/div 0.6 ? load connected to enabled device 2ms/div short circuit with blanking time and recovery 50ms/div power on 1ms/div power off 10ms/div iout 1a/div vflag 5v/div v in = 5v t a = +25c c l = 100f t a = +25c c l = 100f r l = 2.5 ? iout 2a/div vout 5v/div vout 5v/div vflag 5v/div v in = 5v t a = +25c c l = 100f vflag 5v/div iout 1a/div vin 5v/div iout 500ma/div ven 5v/div v in = 5v t a = +25c c l = 100f iout 500ma/div ven 5v/div v in = 5v t a = +25c r l = 2.5 ? c l =470f c l =220f c l =100f vflag 5v/div iout 1a/div vin 5v/div vout 5v/div t a = +25c c l = 100f r l = 2.5 ?
ap2101/ap2111 document number: ds32015 rev. 3 - 2 6 of 14 www.diodes.com january 2013 ? diodes incorporated ap2101/ap2111 typical performance characteristics (cont.) device enabled 1ms/div device disabled 1ms/div uvlo increasing 1ms/div uvlo decreasing 10ms/div turn-on time vs input voltage 250 350 450 550 650 750 850 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 input voltage (v) turn-on time (us) turn-off time vs input voltage 25 30 35 40 45 50 55 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 input voltage (v) turn-off time (us) vflag 5v/div iout 1a/div ven 5v/div vout 5v/div vflag 5v/div iout 1a/div ven 5v/div vout 5v/div c l = 1f r l = 10 ? t a =+ 25 c c l = 1f r l = 10 ? t a =+ 25 c iout 500ma/div t a = +25c c l = 100f r l = 2.5 ? vin 2v/div iout 500ma/div t a = +25c c l = 100f r l = 2.5 ? vin 2v/div v in = 5v t a = +25c c l = 100f r l = 2.5 ? v in = 5v t a = +25c c l = 100f r l = 2.5 ?
ap2101/ap2111 document number: ds32015 rev. 3 - 2 7 of 14 www.diodes.com january 2013 ? diodes incorporated ap2101/ap2111 typical performance characteristics (cont.) rise time vs input voltage 300 350 400 450 500 550 600 650 22.533.544.555.56 input voltage (v) rise time (us) fall time vs input voltage 19 20 21 22 23 24 25 22.533.544.555.56 input voltage (v) fall time (us) supply current, output enabled vs ambient temperature 27 32 37 42 47 52 -60 -40 -20 0 20 40 60 80 100 ambient temperature (c) supply current, output enabled (ua) supply current, output disabled vs ambient temperature 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 -60 -40 -20 0 20 40 60 80 100 ambient temperature (c) supply current, output disabled (ua) static drain-source on-state resistance vs ambient temperature 70 80 90 100 110 120 130 140 -60 -40 -20 0 20 40 60 80 100 ambient temperature (c) static drain-source on-state resistance (m ? ) short-circuit output current vs ambient temperature 2.30 2.35 2.40 2.45 2.50 2.55 2.60 2.65 2.70 -60 -40 -20 0 20 40 60 80 100 ambient temperature (c) short-circuit output current (a) vin=3.3v vin=5.0v vin=3.3v c l = 120f vin=5.0v vin=3.3v vin=5.5v vin=5.0v vin=5.5v vin=3.3v c l = 1f r l = 10 ? t a = +25c c l = 1f r l = 10 ? t a =+ 25 c vin=5.0v
ap2101/ap2111 document number: ds32015 rev. 3 - 2 8 of 14 www.diodes.com january 2013 ? diodes incorporated ap2101/ap2111 typical performance characteristics (cont.) undervoltage lockout vs ambient temperature 1.90 1.95 2.00 2.05 2.10 2.15 -60 -40 -20 0 20 40 60 80 100 ambient temperature (c) undervoltage lockout (v) threshold trip current vs input voltage 3.08 3.10 3.12 3.14 3.16 3.18 3.20 3.22 3.24 2.8 3.3 3.8 4.3 4.8 5.3 input voltage (v) threshold trip current (a) current limit response vs peak current 0 5 10 15 20 25 30 35 40 45 024681012 peak current (a) current limit response (us) uvlo falling uvlo rising t a = +25c c l = 68f v in = 5v t a = +25c
ap2101/ap2111 document number: ds32015 rev. 3 - 2 9 of 14 www.diodes.com january 2013 ? diodes incorporated ap2101/ap2111 application information power supply considerations a 0.1- f to 1- f x7r or x5r ceramic bypass capacitor between in and gnd, close to the device, is recommended. placing a high-value electrolytic capacit or on the input (10- f minimum) and output pin(s) is recommended when the output load is heavy. th is precaution reduces power-supply transients that may cause ringing on the input. additionally, bypassing the output with a 0.01- f to 0.1- f ceramic capacitor improves the immunity of the dev ice to short-circuit transients. over-current and short circuit protection an internal sensing fet is employed to c heck for over-current conditions. unlike curr ent-sense resistors, sense fets do not inc rease the series resistance of the current path. when an overcurrent condition is detected, the device maintains a constant output current and r educes the output voltage accordingly. complete shutdown occurs only if the fault stays long enough to activate thermal limiting. three possible overload conditions can occur. in the first condition, the output has been shorted to gnd before the device is e nabled or before vin has been applied. the ap2101/ap2111 senses the short circuit and immediat ely clamps output current to a certain safe level namely i limit . in the second condition, an output short or an overload occurs while the device is enabl ed. at the instance the overload occur s, higher current may flow for a very short period of time before the current lim it function can react. after t he current limit function has trip ped (reached the over- current trip threshold), the device switches into current limiting mode and the current is clamped at i limit . in the third condition, the load has been gradually increased be yond the recommended operating current. the current is permitte d to rise until the current-limit threshold (i trig ) is reached or until the thermal limit of the device is exceeded. the ap2101/ap2111 is capable of delivering current up to the current-limit threshold without damaging the device. on ce the threshold has been reached, the device switches into it s current limiting mode and is set at i limit . to protect against short circuit to gnd at extr emely low temperature (< -30c), a minimum 120- f electrolytic capacitor on the output pin is recommended. a correct capacitor type with capacitor voltage rati ng and temperature characteristics must be properly chosen so that capacitance value does not drop too low at the extremely low te mperature operation. a recomm ended capacitor should have temper ature characteristics of less than 10% variati on of capacitance change when operated at extr emely low temp. our recommended aluminum electrolytic capacitor type is panasonic fc series. at low input voltage condition (v in < 3v), the short circuit protection current ma y rise as high as twice the typical value. flg response when an over-current or over-temperature shutdown condition is encountered, the flg open -drain output goes active low after a n ominal 7-ms deglitch timeout. the flg output remains low until both over-curr ent and over-temperature conditions are removed. connecting a heavy capacitive load to the output of the device can cause a momentary over-current conditi on, which does not trigger the flg due to the 7-ms deglitch timeout. the ap2101/ap2111 is designed to elimi nate false over-current reporting without the need of external components to rem ove unwanted pulses. power dissipation and junction temperature the low on-resistance of the internal mosfet allows the small surface-mount packages to pass large current. using the maximum o perating ambient temperature (t a ) and r ds(on) , the power dissipation can be calculated by: p d = r ds(on) i 2 finally, calculate the junction temperature: t j = p d x r ja + t a where: t a = ambient temperature c r ja = thermal resistance p d = total power dissipation
ap2101/ap2111 document number: ds32015 rev. 3 - 2 10 of 14 www.diodes.com january 2013 ? diodes incorporated ap2101/ap2111 application information (cont.) thermal protection thermal protection prevents the ic from damage when heavy-overload or short-circuit faults are present for extended periods of time. the ap2101/ap2111 implements a thermal sensing to monitor the operati ng junction temperature of the power distribution switch. once the die temperature rises to approximately 140c due to excessive power di ssipation in an over-current or short-circuit condition the i nternal thermal sense circuitry turns the power switch off, thus preventing the power switch from damage. hysteresis is built into the thermal sense circuit allowing the device to cool down approximately 25c before the switch turn s back on. the switch continues to cycle in this manner until the load fault or input power is removed. the flg open-drain output is asserted when an over-temperature shutdown or over-current occurs with 7-m s deglitch. under-voltage lockout (uvlo) under-voltage lockout function (uvl o) keeps the internal power switch from bei ng turned on until the power supply has reached a t least 1.9v, even if the switch is enabled. whenever the input voltage falls below approximately 1.9v, the power switch is quickly turned of f. this facilitates the design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed. host/self-powered hubs hosts and self-powered hubs (sph) have a local power supply that powers the embedded functions and the downstream ports. this p ower supply must provide from 5.25v to 4.75v to the board side of the downstream connection under both full-load and no-load conditions. ho sts and sphs are required to have current-limit protection and must report ov er-current conditions to the usb controller. typical sphs are d esktop pcs, monitors, printers, and stand-alone hubs. generic hot-plug applications in many applications it may be necessary to remove modules or pc boards while the main unit is still operating. these are consi dered hot-plug applications. such implementations require th e control of current surges seen by the main power supply and the card being inser ted. the most effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a power supply normally turns on. due to the controlled rise times and fall times of the ap2101/ap2111, these devices can be used to provide a softer start-up to devices being hot-plugged into a powered system. the uvlo feature of the ap2101/ap2111 also ensures that the switch is off after the card has been removed, and that the switch is off during the next insertion. by placing the ap2101/ap2111 between the vcc input and the rest of t he circuitry, the input power reaches these devices first a fter insertion. the typical rise time of the switch is approximately 1ms, provid ing a slow voltage ramp at the output of the device. this imple mentation controls system surge current and provides a hot-plugging mechanism for any device.
o m a p2101/ap 2 document numbe r o rdering i n part nu m ap21x1 s ap21x1m p m arking in f (1) so-8 (2) msop-8 e 2 111 r : ds32015 rev. 3 n formatio n m ber p s g-13 p g-13 f ormation par t 6 : a 7 : a e p pa r 6 : a 7 : a - 2 n p ackage code s mp t numbe r logo a ctive lo w a ctive high r t number logo a ctive low a ctive high w packagi n so-8 msop-8 e ap2 1 ( to p yy w 87 1 2 ap21 ( top v 87 1 2 11 of 14 w ww.diodes.co n g e p 1 x x d p view ) w w x x 65 34 x x d v iew ) y w x e 65 34 m quantit y 2500/tape & 2500/tape & ww : we yy : yea r g : gree n x : intern a 1 : 1 cha n represen t y : year : 0 ~ a~z : gree n 1 : 1 chann a~z : 27~5 2 w : week : 52 and 53 w msop-8-e p 13? tape a n y reel reel ek : 01~52; 5 2 r : 08, 09,10~ n a l code n nel t s 52 and 53 w ~ 9 n e l 2 week; z rep r a~z : 1~26 we w ee k p ap2101/ a n d reel part num b -1 -1 2 w eek r esents e k ; january 201 ? diodes incorporat e a p2111 b er suffix 3 3 3 e d
ap2101/ap2111 document number: ds32015 rev. 3 - 2 12 of 14 www.diodes.com january 2013 ? diodes incorporated ap2101/ap2111 package outline dimensions (all dimensions in mm.) please see ap02002 at http://www.diodes.com /datasheets/ap02002.pdf for latest version. (1) so-8 (2) msop-8ep so-8 dim min max a - 1.75 a1 0.10 0.20 a2 1.30 1.50 a3 0.15 0.25 b 0.3 0.5 d 4.85 4.95 e 5.90 6.10 e1 3.85 3.95 e 1.27 typ h - 0.35 l 0.62 0.82 0 8 all dimensions in mm msop-8ep dim min max typ a - 1.10 - a1 0.05 0.15 0.10 a2 0.75 0.95 0.86 a3 0.29 0.49 0.39 b 0.22 0.38 0.30 c 0.08 0.23 0.15 d 2.90 3.10 3.00 d1 1.60 2.00 1.80 e 4.70 5.10 4.90 e1 2.90 3.10 3.00 e2 1.30 1.70 1.50 e3 2.85 3.05 2.95 e - - 0.65 l 0.40 0.80 0.60 a 0 8 4 x - - 0.750 y - - 0.750 all dimensions in mm gauge plane seating plane detail ?a? detail ?a? e e1 h l d e b a2 a1 a 45 7 ~ 9 a3 0.254 1 d a a1 a2 e e y x seating plane gauge plane l d 8xb see detail c detail c c a e1 e3 a3 e2 4 x 1 0 4 x 1 0 0.25 d1
ap2101/ap2111 document number: ds32015 rev. 3 - 2 13 of 14 www.diodes.com january 2013 ? diodes incorporated ap2101/ap2111 suggested pad layout please see ap02001 at http://www.diodes.com/dat asheets/ap02001.pdf for the latest version. (1) so-8 (2) msop-8-ep dimensions value (in mm) x 0.60 y 1.55 c1 5.4 c2 1.27 dimensions value (in mm) c 0.650 g 0.450 x 0.450 x1 2.000 y 1.350 y1 1.700 y2 5.300 x c1 c2 y g x c y y2 y1 x1
ap2101/ap2111 document number: ds32015 rev. 3 - 2 14 of 14 www.diodes.com january 2013 ? diodes incorporated ap2101/ap2111 important notice diodes incorporated makes no warranty of any kind, express or implied, with regards to this document, including, but not limited to, the implied warranties of merchantability and fitness for a particular purpose (and their equivalents under the laws of any jurisdiction). diodes incorporated and its subsidiaries rese rve the right to make modifications, enhanc ements, improvements, corrections or ot her changes without further notice to this document and any product descri bed herein. diodes incorporated does not assume any liability ari sing out of the application or use of this document or an y product described herein; neither does di odes incorporated convey any license under its patent or trademark rights, nor the rights of others. any customer or us er of this document or products described herein in such applica tions shall assume all risks of such use and will agree to hold diodes incorporated and all the companies whose products are represented on diodes incorporated website, harmless against all damages. diodes incorporated does not warrant or accept any liability w hatsoever in respect of any products purchased through unauthoriz ed sales channel. should customers purchase or use diodes inco rporated products for any unintended or una uthorized application, customers shall i ndemnify and hold diodes incorporated and its representativ es harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death a ssociated with such unintended or unauthorized application. products described herein may be covered by one or more united states, international or foreign patents pending. product names and markings noted herein may also be covered by one or more united states, international or foreign trademarks. this document is written in english but may be translated into multiple languages for reference. only the english version of t his document is the final and determinative format released by diodes incorporated. life support diodes incorporated products are specifically not authorized for use as critical component s in life support devices or systems without the express written approval of the chief executive offi cer of diodes incorporated. as used herein: a. life support devices or syst ems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when proper ly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. b. a critical component is any component in a life support devic e or system whose failure to perform can be reasonably expect ed to cause the failure of the life support device or to affect its safety or effectiveness. customers represent that they have all necessary expertise in the safety and regulatory ramifi cations of their life support dev ices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-rel ated requirements concerning the ir products and any use of diodes incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or s ystems-related information or support that may be provided by diodes incorporated. further, customers must fully indemnify diodes incorporate d and its representatives against any damages arisi ng out of the use of diodes incorporated pr oducts in such safety-critical, life suppor t devices or systems. copyright ? 2013, diodes incorporated www.diodes.com

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